COB LED Chip

COB is the abbreviation of Chip On Board, which means chip-on-board packaging technology. It is a semiconductor packaging process in which the chip is bonded to an interconnect substrate with conductive or non-conductive adhesive, and then electrically connected by wire bonding.

As a new type of packaging method, COB has obvious advantages. It can achieve P0.9 or even smaller dot pitch, which meets the market’s demand for more high-definition displays. The LED display of this packaging technology is also lighter and thinner, with higher surface flatness. However, the current cost of COB production is relatively high, and cannot be applied to outdoor LED display products.